About:

Lightweight materials, with their philosophy, concepts, and designs that intertwine high-performance materials with geometry and topology, are found in a variety of applications. These include natural and biomaterials, as well as engineered composites and structures like bridges, planes, and wind turbines, making ‘lightweight’ a truly universal collaboration framework.

The primary goal of this symposium is to introduce and discuss current trends in the development and exploration of lightweight materials and structures. Through these discussions, we aim to define overarching interests and shared grounds that could foster collaborations beyond traditional research fields and industrial sectors.

The symposium is designed for a diverse audience, including R&D units, researchers, industrial stakeholders, and students whose interests lie in materials and material technologies. Lightweight materials, structures, and designs hold the potential for crucial breakthroughs and paradigm shifts in existing design practices.

This event will serve as a forum for fostering interdisciplinary dialogue and forging future collaborations across disciplines, sectors, and applications.

Price: Free

Thanks to our generous partners, including Aarhus University Centre for Integrated Materials Research (iMAT), the Centre for Defence, Space & Security (CenSec), the Danish Centre for Applied Mathematics and Mechanics (DCAMM), and IDA Space, participation in SLiMS will be free of charge.

For IDA members: Aarhus University, the Danish Technological Institute and Danish Graphene ApS have entered into a collaboration with IDA Space. The collaboration involves joint marketing. All registration takes place through the AU platform and after the event, AU sends a participant list (name and email) to IDA, which registers the number of registered IDA members, and then the list is deleted. 

For non-IDA members: Your information will be deleted and not used for anything. 

Contact organizers: 

For any questions in relation to the event please contact:

• Michal K. Budzik, mibu@mpe.au.dk 
• Nichlas Oxfeldt Foldager: nof@danishgraphene.com 
• Nikolaj Zangenberg: nzg@teknologisk.dk